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AlCuFlex™ - Core Tech & Substrates
Core Technology: Etching (double-sided supported) for circuit formation → copper processing (ensures reliability)
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Core Technology: Etching (double-sided supported) for circuit formation → copper processing (ensures reliability)
AlCuFlex™ - Core Tech & Substrates
Header: AlCuFlex™ Composite Foil (Aluminum-Copper Plated Foil)
• Core Technology: Etching (double-sided supported) for circuit formation → copper processing (ensures reliability)
• Supported Substrates: PI (Polyimide) / PET (Polyethylene Terephthalate) / Paper
Visual Suggestion: Simplified diagram of etching process
AlCuFlex™ - Potential Applications
Header: AlCuFlex™ - Potential Applications
• Hybrid bonded NFC stickers (capacitive + NFC chip)
• NFC chips with I/O interfaces (alarm & open-circuit detection)
• NFC tags (single-layer coil + silver ink process)
• SMT-required NFC electronics/UHF products
• Roll-to-roll Bluetooth stickers (RFID-based process testing)
• Ultra-small NFC circuits (min diameter < 6–8mm)
• Antenna-welded IoT products (boosts yield for printed batteries/OPV cells)
• Flexible lightweight backlight substrates (for ultra-thin bendable displays)
Visual Suggestion: 2×4 grid layout with small application icons
AlCuFlex™ - Specifications (1)
Header: AlCuFlex™ - Specifications (Aluminum Foil/Copper & PET)
Category | Item | Unit | Value | Tolerance |
Aluminum Foil/Copper | Aluminum Content | % | >99 | / |
Aluminum Thickness | μm | 10/30 | ±2 | |
Copper Content | % | >99 | / | |
Copper Thickness | μm | 3 | ±0.5 | |
Width | mm | 350 | ±2 | |
PET Substrate | Thickness | μm | 50 (38 optional) | ±5% |
Width | mm | 360 | ±2 |
AlCuFlex™ - Specifications (2)
Header: AlCuFlex™ - Specifications (Thermal & Composite)
Category | Item | Unit | Value | Tolerance |
PET Substrate | Thermal Shrinkage (150°C,30min) - MD | % | ≤0.4 | / |
Thermal Shrinkage (150°C,30min) - TD | % | ≤0.1 | / | |
Composite Material | Width | mm | 350/520 | ±2 |
Adhesive Coating Weight | g/m² | 1.75-1.85 | / | |
Adhesive Thickness | μm | 2 | / |
AlCuFlex™ - Storage & Quality Assurance
Header: AlCuFlex™ - Storage & Quality Assurance
• Storage Requirements:
a. Environment: 10-28°C, RH < 55% (cool, ventilated, clean warehouse)
b. Avoid: Direct sunlight, corrosive substances
c. Shelf Life: 6 months from production date
• Quality Assurance: Equipped with professional inspection equipment (see attached images for details)
